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Polyramic® - Resins for Electronics Laminate

Starfire® Systems has developed a class of "green" polymers called Polyramic® that combine organic manufacturing processes with the performance and stability of inorganic materials.  Laminates produced from Polyramic® provide the electrical engineer exceptional flexibility with demonstrated properties including low loss factor (Df of 0.0015), low dielectric constant (Dk of 2.9), halogen free / RoHS compliance, inherent flame retardance (UL-94 V-0), and a low stable x,y CTE (8 - 10 ppm/°C) before the addition of filler materials.  Polyramic® have been studied by the Packaging Research Center at Georgia Tech

Polyramic® Resins by Starfire Systems:  
Ceramic performance at the cost and convenience of a thermoplastic.

Click here for Data Sheet 
Click here to learn Industry Substrate Roadmap Issues
Click here to view Laminate Properties Questionnaire
Click here to view Resin Properties Questionnaire 

 

 Comparison of Laminate Materials

Attribute

FR4

BT

Pl

PTFE

Polyramic®

Tg  (oC)  TMA Method

175

170 - 220

230 - 260

220

>300

CTE ppm (x,y)

60

50

45 - 60

29

8 - 10

Dielectric Constant (Dk)

4.0 - 4.3

4.1 - 4.2

4.0 - 4.6

3

2.9

Dielectric Loss (Df)

0.022

0.01

0.012 - 0.016

0.001

0.001

Dielectric Breakdown (kV)

20

25

20

30

5

Modulus GPa

10

14

10-20

5

15-30






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