Applications - Electronic Materials
Polyramic® - Resins for Electronics Laminate
Starfire® Systems has developed a class of "green" polymers called Polyramic® that combine organic manufacturing processes with the performance and stability of inorganic materials. Laminates produced from Polyramic® provide the electrical engineer exceptional flexibility with demonstrated properties including low loss factor (Df of 0.0015), low dielectric constant (Dk of 2.9), halogen free / RoHS compliance, inherent flame retardance (UL-94 V-0), and a low stable x,y CTE (8 - 10 ppm/°C) before the addition of filler materials. Polyramic® have been studied by the Packaging Research Center at Georgia Tech.
Polyramic® Resins by Starfire Systems:
Ceramic performance at the cost and convenience of a thermoplastic.
Click here for Data Sheet
Click here to learn Industry Substrate Roadmap Issues
Click here to view Laminate Properties Questionnaire
Click here to view Resin Properties Questionnaire
|
Comparison of Laminate Materials
|
|
Attribute
|
FR4
|
BT
|
Pl
|
PTFE
|
Polyramic®
|
|
Tg (oC) TMA Method
|
175
|
170 - 220
|
230 - 260
|
220
|
>300
|
|
CTE ppm (x,y)
|
60
|
50
|
45 - 60
|
29
|
8 - 10
|
|
Dielectric Constant (Dk)
|
4.0 - 4.3
|
4.1 - 4.2
|
4.0 - 4.6
|
3
|
2.9
|
|
Dielectric Loss (Df)
|
0.022
|
0.01
|
0.012 - 0.016
|
0.001
|
0.001
|
|
Dielectric Breakdown (kV)
|
20
|
25
|
20
|
30
|
5
|
|
Modulus GPa
|
10
|
14
|
10-20
|
5
|
15-30
|