Starfire has designed a class of thin ceramic fiber reinforced laminates of silicon carbide as packaging substrates for the electronics and semiconductor industries. STARBoard^® properties of thermal conductivity, strength, electrical conductivity, and light weight can be tailored to meet requirements of different industrial applications. All variants of STARBoard^® combine Starfire?s advanced pre-ceramic polymers with carefully selected fabrics to form a silicon carbide matrix substrate that achieves desired performance requirements.

STARBoard^® G offers improved physical and electrical properties over PTFE and polyimide material systems while maintaining a competitive cost structure. These glass fabric composites that are similar to commercially available PCB's but are easily machineable and can be tailored to achieve a wide range of performance characteristics. They offer a minimum coefficient of temperature expansion (CTE) reduction of 80% compared with standard Polyimide substrates. STARBoard^® G also provides the lowest dielectric constant and loss tangent of all of our substrates. It is optimal for high-end applications in the medical, aerospace, and semiconductor packaging applications.

STARBoard^® C offers the potential for total microminiaturization with coefficient of thermal expansion (CTE) rates similar to that of standard silicon wafers. High performance dielectrics allow for direct deposition of very fine metal lines onto the substrate surface. Manufacturing sizes are customizable and scalable from 300mm and greater. STARBoard^® C is optimal for applications where weight and size must be reduced without compromising the strength or electrical properties of the deposited electronics.

STARBoard^® A is intended for applications where continuous high temperature performance and reliability is critical. This is our most heat resistant substrate, offering continuous operation temperatures up to 600ºC. This flat polished wafer offers a stable substrate for improved electrical properties in demanding high temperature environments.

Substrate Material
Properties	STARBoard® A	STARBoard® C	STARBoard® G	Polyimide®
Operating Temp.	~500ºC-600ºC	~350ºC	~450ºC	~500ºC
CTE (PPM/ºC)	4 - 5	2.5 - 3.5	5 - 10	55
Dielectric Constant	7.55	--	3.9	4.5
Loss Tangent	0.03	--	0.001	--

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